Technical Capabilities
Please click on the links below for the standard manufacturing specifications for Evolution Circuits. If additional specifications are required, please contact us directly and we will be happy to assist you.
Coatings are applied to the exposed circuit areas to protect the copper from
oxidization, they also act on features as an inter metallic to enable a reliable
component joint to be formed during assembly manufacture. We can also meet your
future needs, as we move towards the WEEE (Waste Electrical and Electronic Equipment)
deadline.
Finish Type
Coating Thickness
Hot Air Solder Level
3-8µm
OSP
0.2-0.4µm
Immersion Silver
0.1-0.3µm
Immersion Gold
0.05-0.15µm
Electroless Nickel
3.0-8.0µm
Electroplated Gold
0.1-2.5µm
Electroplated Nickel
5.0-10.0µm
Carbon Ink
15-30µm
Immersion Tin
0.1-0.3µm
Evolution Circuits
T +44 (0)1536 525215 | F +44 (0)1536 525214 | E sales@evolution-circuits.com
