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Please click on the links below for the standard manufacturing specifications for Evolution Circuits. If additional specifications are required, please contact us directly and we will be happy to assist you.
Material Specification
| Maximum panel size - double sided |
762mm x 610mm (30" x 24”) |
| Maximum panel size – multi-layer |
711mm x 610mm (28" x 24”) |
| Maximum layer count (multi-layer) |
20 |
| Minimum board thickness (PTH) |
0.25mm (0.010”) |
| Maximum board thickness |
5.00mm |
| Minimum core thickness |
0.10mm |
| Cu Foil thickness – O/L |
¼, ½, 1, 2, 3, 4, 5 oz |
| Cu Foil thickness – I/L |
¼, ½, 1, 2, 3, 4, oz |
| Dielectric constant er @ 1MHz |
3 - 5 |
We offer a wide range of materials in our portfolio of approved materials and
suppliers.
These include but are not limited to:
| Material Type |
CTE (x-y) ppm/C |
CTE (Z) ppm/C |
Df (loss tangent) |
Dk (Permittivity) |
Tg °C |
Applications |
| Multifunctional Epoxy |
17 |
145 |
0.030 |
4.40 |
140 |
Personal Computers, Standard Electronics, Automotive |
| High Temp Epoxy |
13 |
110 |
0.027 |
4.30 |
175 |
Backplanes, Automotive, High Reliability |
| Low loss Epoxy |
15 |
60 |
0.009 |
3.50 |
180 |
High Speed Digital & Analogue Systems |
| Hydrocarbon Ceramic/ Woven Glass |
16 |
50 |
0.002 |
3.20 |
280 |
Low Loss, High Frequency, Broadband, PTFE Low Cost |
| Alternative BT Epoxy |
15 |
85 |
0.013 |
4.00 |
180 |
High Reliability, Low Loss |
| Polyimide/ Woven Glass |
14 |
60 |
0.017 |
3.90 |
260 |
Burn In, High Temp Applications |
| Thermount (Aramid) Epoxy |
9 |
40 |
0.038 |
3.90 |
180 |
Laser Micro-Via, Controlled X-Y CTE, HDI |
| Thermount (Aramid) Polyimide |
9 |
15 |
0.015 |
3.60 |
220 |
Laser Micro-Via, Controlled X-Y CTE, HDI |
| Cyanate Ester |
17 |
145 |
0.006 |
3.80 |
250 |
High Reliability, Low Loss |
| Halogen / Lead Free |
13 |
120 |
0.015 |
4.60 |
170 |
Environmental |
Blind & Buried Vias
Blind via, buried via and blind & buried via options are offered on all multilayer
orders, subject to review of data.
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